PCB PRODUCT
FPC
FPC has excellent characteristics such as lightweight, free bending and folding. Compared with PCB, the process is more complex and can better reflect the comprehensive strength of an enterprise.Chengde has its own production workshop, drilling rig, electroplating line equipment, exposure machine, printing machine, constant temperature iron plate, press, punch and other advanced production equipment. FPC is widely used in consumer electronics, military, aviation, medical, industrial and other fields. Chengde provides FPC technical support, design, patch, and after-sales service, and has a professional and united team.
| Specification | PCB Capabilities |
|---|---|
| Layers | 1-8 |
| Build time | 7-15 days |
| Min/Max Size | 50*80/580*1200mm |
| FPC Copper Thickness | min=8um；max=35um |
| FPC PI Thickness | min=12.5um；max=50um |
| Min Test Pad | 0.2mm |
| Final FPC size | 2*2mm |
| Minimum trace width/space | FPC PCBs: 2mil/2mil |
| Drilling Diameter | min=0.10mm；max=6.0mm |
| Copper thickness | 8-25μm |
| Molding Board Thickness | 1.0mm、1.2mm、1.6mm |
| Surface finish | ENIG: Au 1µ to 5µ", Ni 80µ to 200µ" OSP Immersion tin: 0.8µm to 1.2µm Immersion silver: 0.15µm to 0.45µm Hard gold plating: Au 1µ to 50u", Ni 80µ to 200µ" |